pb rohs eccm7ma08-32.768m eccm7 m a 08 -32.768m series rohs compliant (pb-free) 2.5mm x 3.2mm ceramic smd crystal frequency tolerance/stability 15ppm at 25c, 20ppm over -30c to +85c mode of operation at-cut fundamental nominal frequency 32.768mhz load capacitance 8pf parallel resonant electrical specifications nominal frequency 32.768mhz frequency tolerance/stability 15ppm at 25c, 20ppm over -30c to +85c aging at 25c 3ppm/year maximum load capacitance 8pf parallel resonant shunt capacitance (c0) 5pf maximum equivalent series resistance 60 ohms maximum mode of operation at-cut fundamental drive level 100watts maximum crystal cut at-cut spurious response >3db (from fo to fo +5000ppm) storage temperature range -40c to +85c insulation resistance 500 megaohms minimum at 100vdc environmental & mechanical specifications esd susceptibility mil-std-883, method 3015, class 1, hbm: 1500v fine leak test mil-std-883, method 1014, condition a flammability ul94-v0 gross leak test mil-std-883, method 1014, condition c mechanical shock mil-std-883, method 2002, condition b moisture resistance mil-std-883, method 1004 moisture sensitivity j-std-020, msl 1 resistance to soldering heat mil-std-202, method 210, condition k resistance to solvents mil-std-202, method 215 solderability mil-std-883, method 2003 temperature cycling mil-std-883, method 1010, condition b vibration mil-std-883, method 2007, condition a mechanical dimensions (all dimensions in millimeters) pin connection 1 crystal 2 cover/ground 3 crystal 4 cover/ground line marking 1 e32.7 e=ecliptek designator 2 xxxxx xxxxx=ecliptek manufacturing identifier www.ecliptek.com | specification subject to change without notice | rev i 8/12/2010 | page 1 of 4 3.20 0.10 2.50 0.10 0.80 max 0.70 0.10 1.20 0.10 marking orient a tion 1 2 3 4 0.90 0.10 (x4) 1.00 0.10 (x4)
eccm7ma08-32.768m 0.8 0.4 1.3 (x4) 1.3 (x4) www.ecliptek.com | specification subject to change without notice | rev i 8/12/2010 | page 2 of 4 all t oler ances are 0.1 sug g ested solder p ad la y out solder land (x4) all dimensions in millimeters
t min s t max s critical zone t to t l p ramp-up ramp-down t l t p t 25 c to peak t preheat s t l t p temperature (t) time (t) recommended solder reflow methods eccm7ma08-32.768m high temperature infrared/convection ts max to tl (ramp-up rate) 3c/second maximum preheat - temperature minimum (ts min) 150c - temperature typical (ts typ) 175c - temperature maximum (ts max) 200c - time (ts min) 60 - 180 seconds ramp-up rate (tl to tp) 3c/second maximum time maintained above: - temperature (tl) 217c - time (tl) 60 - 150 seconds peak temperature (tp) 260c maximum for 10 seconds maximum target peak temperature (tp target) 250c +0/-5c time within 5c of actual peak (tp) 20 - 40 seconds ramp-down rate 6c/second maximum time 25c to peak temperature (t) 8 minutes maximum moisture sensitivity level level 1 www.ecliptek.com | specification subject to change without notice | rev i 8/12/2010 | page 3 of 4
t min s t max s critical zone t to t l p ramp-up ramp-down t l t p t 25 c to peak t preheat s t l t p temperature (t) time (t) recommended solder reflow methods eccm7ma08-32.768m low temperature infrared/convection 245c ts max to tl (ramp-up rate) 5c/second maximum preheat - temperature minimum (ts min) n/a - temperature typical (ts typ) 150c - temperature maximum (ts max) n/a - time (ts min) 30 - 60 seconds ramp-up rate (tl to tp) 5c/second maximum time maintained above: - temperature (tl) 150c - time (tl) 200 seconds maximum peak temperature (tp) 245c maximum target peak temperature (tp target) 245c maximum 2 times / 230c maximum 1 time time within 5c of actual peak (tp) 10 seconds maximum 2 times / 80 seconds maximum 1 time ramp-down rate 5c/second maximum time 25c to peak temperature (t) n/a moisture sensitivity level level 1 low temperature manual soldering 185c maximum for 10 seconds maximum, 2 times maximum. high temperature manual soldering 260c maximum for 5 seconds maximum, 2 times maximum. www.ecliptek.com | specification subject to change without notice | rev i 8/12/2010 | page 4 of 4
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